Highly filled liquid epoxy for smaller, more reliable chip packaging

Highly filled liquid epoxy for smaller, more reliable chip packaging. As computer chips become more powerful and compact, the materials that protect them must perform better than ever.

A apuração publicada por phys.org vira base para uma leitura editorial direta e contextualizada.

Trechos de apoio da pauta: As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In advanced chip packaging, liquid epoxy is widely used because it can flow into tiny spaces before curing into a solid protective layer.

• Ponto de atenção: highly.
• Ponto de atenção: filled.
• Ponto de atenção: liquid.

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